Application of plasma treatment machine in LED packaging process

The application of plasma treatment machine in LED packaging process is in the following aspects:

1. Before the plasma treatment machine points silver glue

The pollutants on the substrate will cause the silver glue to be spherical, which is not conducive to chip pasting, and it is easy to cause damage to the chip when it is manually pierced. The use of plasma cleaning can greatly improve the surface roughness and hydrophilicity of the workpiece, which is conducive to the flattening of the silver glue and chip pasting. At the same time, it can greatly save the use of silver glue and reduce costs.

2. Before the plasma treatment machine wire bonding

After the chip is pasted on the substrate, it is cured at high temperature. The pollutants on it may include microparticles and oxides. These pollutants cause incomplete welding or poor adhesion between the wire and the chip and the substrate through physical and chemical reactions, resulting in insufficient bonding strength. Radio frequency plasma cleaning before wire bonding will significantly improve its surface activity, thereby improving the bonding strength and the uniformity of the tension of the bonding wire. The pressure of the bonding head can be lower (when there are contaminants, the bonding head needs greater pressure to penetrate the contaminants). In some cases, the bonding temperature can also be lowered, thereby increasing production and reducing costs.

3. Plasma Processor Before LED Sealing

During the LED epoxy injection process, contaminants will cause a high bubble formation rate, resulting in low product quality and service life. Therefore, avoiding the formation of bubbles during the sealing process is also a concern. After RF plasma cleaning, the chip and substrate will be more closely combined with the colloid, the formation of bubbles will be greatly reduced, and the heat dissipation rate and light emission rate will be significantly improved.