Application of plasma treatment machine in PI film FPC flexible circuit board industry

The role of PI film plasma cleaning in the production of FPC flexible circuit boards

Polyimide (PI) film is an important component of FPC flexible circuit boards (FPC), with excellent high temperature resistance, chemical resistance, electrical resistance, etc. In the production process of FPC flexible circuit boards, PI film needs to be processed through multiple processes, among which plasma cleaning is one of the important processes.

Plasma cleaning is a technology that uses plasma to clean and modify the surface of an object. Plasma is a gas composed of a large number of charged particles with strong chemical activity. During the plasma cleaning process, the active particles in the plasma react with pollutants and residues on the surface of the object, thereby removing them.

The role of PI film plasma cleaning in the application of FPC flexible circuit boards is mainly reflected in the following aspects:

● Removal of surface pollutants: PI film will be affected by various pollutants during the production process, such as oil, dust, oxide film, etc. These pollutants will affect the surface properties of PI film, such as conductivity, light transmittance, etc. Plasma cleaning can effectively remove these pollutants and make the surface of PI film cleaner.

● Surface modification: Plasma cleaning can modify the surface of PI film, such as increasing surface roughness, changing surface energy, etc. Surface modification can improve the adhesion and printability of PI film with other materials.

● Removal of residues: Various chemical reagents and materials are used in the production process of FPC flexible circuit boards. These reagents and materials will remain on the surface of PI film after use. Plasma cleaning can effectively remove these residues to avoid affecting subsequent processes.

Specifically in the application of FPC flexible circuit boards, PI film plasma cleaning is mainly used in the following aspects:

● Pre-lamination treatment: Before lamination of FPC flexible circuit boards, PI film needs to be cleaned and surface modified. Plasma cleaning can remove pollutants on the surface of PI film, increase surface roughness, and improve the adhesion of PI film with other materials.

● Gold finger processing: During the gold finger processing of FPC flexible circuit boards, the PI film needs to be cleaned. Plasma cleaning can remove pollutants and residues on the surface of the PI film and improve the welding reliability of the gold fingers.

● Other processes: In other processes of FPC flexible circuit boards, such as printing and coating, the PI film also needs to be cleaned. Plasma cleaning can improve the efficiency and quality of the process.

PI film plasma cleaning plays an important role in the application of FPC flexible circuit boards and can improve the performance and reliability of FPC flexible circuit boards.