Plasma surface activation cleaning treatment for electronic products

Plasma surface activation cleaning can process three-dimensional objects uniformly and efficiently, with good controllability and compatibility, perfect functions and professionalism. It is particularly suitable for surface cleaning and surface activation of irregular objects, and is also widely used in the automotive industry, plastic industry, COG binding process and other fields. It can also be used for surface treatment before bonding, soldering and electroplating. As well as surface modification of biomaterials, surface coding of wires and cables, surface coating of plastics, surface cleaning and activation of metal substrates, surface treatment before printing, coating or bonding.

1. Plasma surface activation cleaning function of electronic products

Destroy molecular chemical bonds and play a role in modification. Plasma applications include dust removal, ashing/photoresist/polymer stripping, dielectric etching, wafer bumping, organic pollution removal and wafer demolding. The printing, bonding, coating and other effects of these materials without surface treatment are very poor or even impossible. Plasma technology is used to treat the surface of these materials. Under the bombardment of high-speed and high-energy plasma, the surface structure of these materials is maximized, and an active layer is formed on the surface of the material, so that rubber and plastic can be printed, bonded, coated, etc.

2. Plasma surface activation cleaning technology, a surface coating process with unlimited application potential in electronic products

With the help of plasma technology, new, highly functional and high-quality materials can be produced using low-cost materials. Plasma coating technology is very suitable for selective coating treatment, which greatly expands the application field of this technology.

Module bonding pre-treatment

Touch screen printing pre-treatment (testing surface expansion force/surface energy)